논문
논문 기본정보
Analysis of Chemically and Thermally Induced Residual Stresses in Polymeric Thin Film
| 기관명 | NDSL |
|---|---|
| 저널명 | 반도체디스플레이기술학회지 = Journal of the semiconductor display technology |
| ISSN | 1738-2270, |
| ISBN |
논문 개요
| 저자(한글) | |
|---|---|
| 저자(영문) | |
| 소속기관 | |
| 소속기관(영문) | |
| 출판인 | |
| 간행물 번호 | |
| 빌행연도 | 2015-01-01 |
| 초록 | This paper deals with the residual stresses developed in an epoxy film deposited on Si wafer. First, chemically induced residual stresses due to the volumetric shrinkage in cross-linking resins during polymerization are treated. The curvature measurement method is employed to investigate the residual stresses. Then, thermally induced stresses are investigated along the interface between the epoxy film and Si wafer. The boundary element method is employed to investigate the whole stresses in the film. The singular stress is observed near the interface corner. Such residual stresses are large enough to initiate interface delamination to relieve the residual stresses. |
| 원문URL | http://click.ndsl.kr/servlet/OpenAPIDetailView?keyValue=03553784&target=NART&cn=JAKO201506363291021 |
| 첨부파일 |
추가정보
| 과학기술표준분류 | |
|---|---|
| ICT 기술분류 | |
| DDC 분류 | |
| 주제어 (키워드) | epoxy layer polymeric thin film chemically induced stress curvature measurement method thermally induced stress |