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논문

논문

논문 기본정보

레지스트 잔류층 두께와 몰드 유입속도가 기포결함에 미치는 영향에 대한 수치해석

논문 개요
기관명 NDSL
저널명 반도체디스플레이기술학회지 = Journal of the semiconductor display technology
ISSN 1738-2270,
ISBN

논문 개요

논문저자 및 소속기관 정보
저자(한글) 이우영,김남웅,김동현,김국원
저자(영문)
소속기관
소속기관(영문)
출판인
간행물 번호
빌행연도 2015-01-01
초록 Recently, the major trends of NIL are high throughput and large area patterning. For UV NIL, if it can be proceeded in the non-vacuum environment, which greatly simplifies tool construction and greatly shorten process times. However, one key issue in non-vacuum environment is air bubble formation problem. In this paper, numerical analysis of bubble defect of UV NIL is performed. Fluent, flow analysis focused program was utilized and VOF (Volume of Fluid) skill was applied. For various resist-substrate and resist-mold angles, effects of velocity inlet and residual layer thickness of resist on bubble defect formation were investigated. The numerical analyses show that the increases of velocity inlet and residual layer thickness can cause the bubble defect formation, however the decreases of velocity inlet and residual layer thickness take no difference in the bubble defect formation.
원문URL http://click.ndsl.kr/servlet/OpenAPIDetailView?keyValue=03553784&target=NART&cn=JAKO201506363291170
첨부파일

추가정보

추가정보
과학기술표준분류
ICT 기술분류
DDC 분류
주제어 (키워드) Resist layer thickness Velocity inlet Bubble Nanoimprint Lithography(NIL)